How SinkPAD^TM Helps?

SinkPAD^TM MCPCB Technology reduces LED junction temperature compare to conventional MCPCB, Aluminum PCB or FR4 PCB.

The SinkPAD^TM design completely eliminates the substance with the lowest thermal conductivity/highest thermal resistance from the system. SinkPAD^TM still uses a dielectric, but this dielectric insulates the metal base electrically and leaves it uninsulated thermally. This not only increases thermal conductivity but also directly reduces production costs. In the case of applications that already had inadequate thermal conduction rates and then came to require an active cooling system, the reliance on these active cooling systems can be greatly reduced; reducing the size of these systems or eliminating them altogether will also reduce production costs.

SinkPAD^TM technology is also possible with multilayer printed wiring substrates without effecting thermal performance. Conventional Metal Back multilayer PCB’s add thermal resistance and likely run into a thermal wall, our DIRECT THEMRAL PATH method can maintain direct heat transfer regardless of the number of PWB layers.

• 210 W/m.K–385 W/m.K heat transfer rate
• Direct thermal path
• Lower junction temperature
• Lowest thermal resistance
• Longer LED life
• Enables to drive LED harder. i.e. more lumens per LED
• Enables to get more light output with fewer LEDs. i.e. reduce fixture cost
• Most economical DIRECT THERMAL PATH solution
• Direct replacement for MCPCB and Aluminum PCB
• No design change required. i.e. existing MCPCB design can be used
• Reduces cooling systems costs
• Ideal for surface mount LED components such as High Power & High Bright LED